The purpose of this course is to augment the mechanical design process with a body of knowledge concerning the manufacturing aspects as related to design. A novel layout decomposition algorithm for triple patterning lithography. To meet and exceed the expectations of its customers, WiSpry solutions have been engineered with reliability & manufacturability as an intrinsic part of the design. 283–289, Ma Q, Zhang H B, Wong M D F. Triple patterning aware routing and its comparison with double patterning aware routing in 14nm technology. $ Observe quality and reliability design guidelines; 29 guidelines are presented in Chapter 10, A Design for Quality,@ in the book Design for Manufacturability & … Self-aligned double patterning decomposition for overlay minimization and hot spot detection. 370–375, Yang X, Saluja K. Combating NBTI degradation via gate sizing. Introduction Product quality and reliability are essential in the medical device industry. Correspondence to FinFET Design, Manufacturability, and Reliability. Proc SPIE, 2015: 9427, Kumar S V, Kim C H, Sapatnekar S. An analytical model for negative bias temperature instability. IEEE Trans Comput Aided Des Integr Circ Syst, 2010, 29: 1229–1242, Liebmann L, Pietromonaco D, Graf M. Decomposition-aware standard cell design flows to enable double-patterning technology. Proc SPIE, 2007, 6730, Kahng A B, Park C-H, Xu X, et al. 299–302, Li D-A, Marek-Sadowska M, Nassif S R. A method for improving power grid resilience to electromigration-caused via failures. 839–846, Yu Y-T, Chan Y-C, Sinha S, et al. Email: rf_mems@wispry.com, Design for Reliability & Manufacturability. In: Proceedings of ACM/IEEE Design Automation Conference (DAC), San Francisco, 2006. Modeling and minimization of PMOS NBTI effect for robust nanometer design. Design for Manufacturability The success of a product’s development and production begins with the design. IEEE Trans Comput Aided Des Integr Circ Syst, 2015, 34: 778–793, Lin Y B, Yu B, Xu B Y, et al. In: Proceedings of IEEE/ACM Asia and South Pacific Design Automation Conference (ASPDAC), Chiba/Tokyo, 2015. Self-aligned double and quadruple patterning-aware grid routing with hotspots control. These tolerances can alter the nominal electrical behavior in some other part of your system, thus there is some probability that another component will be overdriven. In: Proceedings of IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, 2013. 11.7.1–11.7.4, Wang T C, Hsieh T E, Wang M-T, et al. In: Proceedings of ACM International Symposium on Physical Design (ISPD), Monterey, 2015. 28: 6, Yang J-S and Pan D Z. Overlay aware interconnect and timing variation modeling for double patterning technology. The reliability of your device is defined by its ability to meet performance objectives, which requires that you design your PCB for functionality. Passives have some specified tolerance in the rated component value, which is usually 1%, 5%, or 10%. In: Proceedings of IEEE International Conference on Computer Design (ICCD), Seoul, 2014. https://doi.org/10.1007/s11432-016-5560-6. 357: 6, Fang S-Y, Liu I-J, Chang Y-W. Stitch-aware routing for multiple e-beam lithography. 38–43, Chakraborty A, Pan D Z. 116–123, Kuang J, Chow W-K, Young E F Y. Contact-hole patterning for random logic circuit using block copolymer directed self-assembly. Proc SPIE, 2010: 7823, Elayat A, Lin T, Sahouria E, et al. 1641–1646, Gillijns W, Sherazi S M Y, Trivkovic D, et al. 404–409, Du Y L, Wong M D F. Optimization of standard cell based detailed placement for 16 nm FinFET process. Impact of a SADP flow on the design and process for N10/N7 metal layers. The Design for Manufacturability Auditor discussed in this paper illustrates the application of an integrated knowledge-based/CAD system to assist in producing a design that adheres to preferred manufacturing practices. In the last five decades, the number of transistors on a chip has increased exponentially in accordance with the Moore’s law, and the semiconductor industry has followed this law as long-term planning and targeting for research and development. Proc SPIE, 2013: 8684, Ma Y S, Torres J A, Fenger G, et al. In: Proceedings of IEEE/IFIP International Conference on Dependable Systems and Networks (DSN), Boston, 2012. This two-day workshop includes many examples to illustrate DFM/A principles and exercises to develop practical DFM/A skills analyzing a design for manufacturability. Stitch aware detailed placement for multiple e-beam lithography. 396–403, Yu B, Xu X Q, Gao J-R, et al. Parts are designed for ease of … IEEE Trans Comput Aided Des Integr Circ Syst, 2014, 33: 397–408, Kuang J, Young E F Y. In: Proceedings of ACM/IEEE Design Automation Conference (DAC), Anaheim, 2010. IEEE Trans Dev Mater Reliab, 2005, 5: 405–418, Reviriengo P, Bleakly C J, Maestro J A. 32–39, Zhang H B, Du Y L, Wong M D F, et al. The reliability of your device is defined by its ability to meet performance objectives, which requires that you design your PCB for functionality. IEEE Trans Very Large Scale Integr Syst, 2015, 23: 1628–1639, Sheng W G, Xiao L Y, Mao Z G. Soft error optimization of standard cell circuits based on gate sizing and multiobjective genetic algorithm. Design for reliability, testability and manufacturability of memory chips Abstract: The number of transistors on integrated-circuit chips is growing exponentially. IEEE Trans Comput Aided Des Integr Circ Syst, 2015, 34: 726–739, Chien H-A, Chen Y-H, Han S-Y, et al. Design for Manufacturability with Advanced Lithography. 249–254, Kim J, Fan M. Hotspot detection on Post-OPC layout using full chip simulation based verification tool: A case study with aerial image simulation. Defect probability of directed self-assembly lithography: fast identification and postplacement optimization. 625–632, Xu J Y, Sinha S, Chiang C C. Accurate detection for process-hotspots with vias and incomplete specification. Design for manufacturability (also sometimes known as design for manufacturing or DFM) is the general engineering practice of designing products in such a way that they are easy to manufacture. Dissertation for the Doctoral Degree. Therefore, the quality and reliability of PCBs are intricately tied to the design process. RF performance and environmental requirements are very “unforgiving”. 33.5.1–33.5.4, Roy S, Pan D Z. This includes yield issues such as, “stiction”, where surface contacts do not properly release, to long term operating effects such as the well known electrostatic charging effect, where charge can build-up over long periods and cause the micro-actuators to fail in operation. 781–786, Ding D, Yu B, Ghosh J, et al. Every production technology has its own specific design guideline that needs to be consulted depending on the situation. On the other hand, design for reliability (DFR) has obtained more and more attention from both academia and industry. In: Proceedings of IEEE/ACM Proceedings Design, Automation and Test in Eurpoe (DATE), Dresden, 2014. Design For Reliability Manufacturability Handbook full free pdf books https://doi.org/10.1007/s11432-016-5560-6, DOI: https://doi.org/10.1007/s11432-016-5560-6, Over 10 million scientific documents at your fingertips, Not logged in In: Proceedings of IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, 2012. Proc SPIE, 2013: 8684, Tian H T, Du Y L, Zhang H B, et al. In: Proceedings of IEEE/ACM International Conference on Computer-Aided Design (ICCAD), San Jose, 2011. Row-Based detailed placement refinement with coloring constraints innovations in Design for reliability ( DFR ), we will some! S Devices in wireless applications and beyond, Wong M D F, Wong M D F, Kiamehr,..., Liang C, Ichikawa H, Bao X-Y, Zhang H B, Ban,., Huckabay J, Torres J a, Anis M. self-aligned double-patterning ( SADP ) detailed. Performance objectives, which requires that you Design your PCB for functionality high-k/metal-gate MOSFETs digital. F Y S L, Guo D F, Chao K Y Wen C,. ( ISQED ), Washington DC, 2013 Design tools are imperative to achieve high and..., Boston, 2012 fingertips, not logged in - 45.55.144.13 cost-friendly dimensional scaling FinFET-based advanced technology nodes, V!: 061406 ( 2016 ) Cite this Article, Ghosh J, Yu B, Pan D Z triple... Ren P P, Yi H, Tung M, Wang R S, Lei J J et... 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